Affiliation:
1. ZhuZhou CSR Times Electric CO.,LTD.
2. Shanghai Jiao Tong University
Abstract
This paper presents a novel patternable electrophoretic polymer (EPP) coating technology for sidewall package in microelectronic devices. The main features of this EPP film are directly patterned via through-mask electrophoretic deposition. The proposed EPP coating has some overwhelming merits against other coating polymers, such as self-patterning via through-mask deposition, good adhesive performance, selective coating, low cost and compatible with IC process. The focus is on the process, patterning, properties characterization and application of this novel electrophoretic polymer. The main applications can be aimed for electrical/thermal isolations or sidewall packaging in semiconductor device package.
Publisher
Trans Tech Publications, Ltd.
Reference9 articles.
1. M. Angelopoulos: Conducting polymers in microelectronics, IBM J. RES. & DEV., 45 (2001) 57-75.
2. X.J. Fan, G.Q. Zhang, L. J. Ernst: A Micromechanics Approach for Polymeric Material Failures in Microelectronic Packaging, ESIME 2002, Paris, France, April 15-17, 2002, pp.1-10.
3. C. Liu: Recent developments in polymer MEMS, Advanced Materials, 19 (2007) 3783-3790.
4. T. Sakata, H. Ishii, N. Sato, et al: Electrodeposition of organic dielectric film and its application to vibrational MEMS devices, Jpn. J. Appl. Phys., 45(2006) 5646-5649.
5. O. Rotting, W. Ropke, H. Becker, C. Gartner: Polymer microfabrication technologies, Microsystem Technologies, 8 (2002) 32-36.