Research on Rheological Properties of Room-Temperature Curing Epoxy Adhesive

Author:

Li Hui1,Luo Ying She1,Xie Jian Jun1,Chen Sheng Ming1

Affiliation:

1. Central South University of Forestry and Technology

Abstract

The rheological mechanical properties of two kinds of self-designed epoxy adhesive curing systems were studied in this paper through the dynamic and static thermodynamics instrument named EPLEXOR 500N made by GABO® company in Germany. Short-term creep tests were carried out under three different temperature conditions of 20°C, 30°C and 40°C and the rheological model is developed to describe the materials creep law. In addition, the test results from the two different epoxy adhesive are also compared and analyzed.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference13 articles.

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4. W. B. Luo, T. Q. Yang, Stress relaxation behavior of solid polymers, J. Polymer Materials Science and Engineering. 2002, 18(20) 97-99. (in Chinese).

5. P. A. O'Connell, G. B. McKenna, Large deformation response of poly cabonate: time-temperature, time-aging time and time-strain superposition, J. Polymer Engineering and Science. 1997, 37(9)1485-1495.

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