Investigation of Low-Cost Copper Interconnection Cleaning Using Hydrogen Radicals Generated by Heated Catalyst-Reference-Cited by-同舟云学术

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Investigation of Low-Cost Copper Interconnection Cleaning Using Hydrogen Radicals Generated by Heated Catalyst

Published:2012-12 Issue: Volume:602-604 Page:1379-1382
ISSN:1662-8985
Container-title:Advanced Materials Research
language:
Short-container-title:AMR

Author:

Kumashiro Y.¹,Ikeda S.¹,Izumi Akira²

Affiliation:

1. Sensui, Tobata, Kitakyushu, Fukuoka 804-8550

2. Dainippon Screen MFG., Corporation, Limited

Abstract

We investigated hydrogen radical copper cleaning via the hot-wire method using only a rotary pump for the vacuum exhaust system. The copper oxide surface was successfully reduced. The treatment also increased the resistance of copper to oxidation.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Link

https://www.scientific.net/AMR.602-604.1379.pdf

Reference9 articles.

1. S.Y. Lee, N. Mettlach, N. Nguyen, Y.M. Sun and J.M. White: Appl. Surf. Sci. 206 (2003) 102.

2. J. Li, G. Vizkeleth, P. Revesz and J.W. Mayer: J. Appl. Phys 69 (1991) 1020.

3. S. Poulston, P.M. Parlett and M. Bowker: Surf. Interf. Anal. 24 (1996) 811.

4. R. Zhou, T. Yu, X. Jiang, F. Chen and X. Zheng: Appl. Surf. Sci. 148 (1999) 263.

5. J. Li, G. Vizkelethy, P. Revesz, J.W. Mayer, L.J. Matienzo, F. Emmi, C. Ortega and J. Siejka: Appl. Phys. Lett. 58 (1991) 1344.

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