Affiliation:
1. Tianjin University of Technology and Education
Abstract
In the hot stamping process, die gap may affect cooling efficiency of the die and the condition of stress-strain. When other conditions are same, die gap were taken for 0.9t, t, 1.1 t, 1.2 t, t is sheetthickness. Temperature field and thickness distribution of the parts are simulated by ANSYS/LS-DYNA module, it is discovered that the distribution of temperature and thickness is uniform when the die gap is 1t and 1.1t. Finally, an experimental is designed to verify the simulation accuracy.
Publisher
Trans Tech Publications, Ltd.
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