Solidification Characteristics of Al-1Fe-0.5Si-XMg Die-Casting Alloys for High Conductivity Demanding Applications

Abstract

Aluminum-Silicon based die-casting alloys have been extensively utilized in various industrial applications, but their relatively low electrical and thermal conductivities make them unsuitable as high conductivity parts. In this research, silicon content was restricted to a comparatively low level for higher conductivity and magnesium was added to enhance the castabilities. Al-1Fe-0.5Si-xMg alloys showed significantly higher electrical conductivity than conventional Al-Si based alloys. As the Mg content was increased, the mold filling ability measured using a fluidity serpentine test mold was a little decreased, however the hot cracking susceptibility was observed to be first increased and then decreased. The relationship between solidification characteristics and castabilities of Al-1Fe-0.5Si-xMg alloys was discussed based on the cooling curve analysis and microstructural characterization results.