Properties of Porous Polyimide Films Based on Melamine Template

Abstract

In this paper, melamine was used as porogen to prepare porous polyimide film by in-situ polymerization. The mechanical properties, thermal properties, dielectric properties, oil content and friction and wear properties of polyimide films with different porosity were investigated. The tensile strength of porous films decreases obviously with increase of melamine content. It shows the lower thermal decomposition temperature and the faster decomposition speed compared with the non-porous film, indicating higher heat exchange rate due to holes in porous films. As the porogen content increases, the dielectric constant decreases significantly, and the film with melamine content of 20 wt.% has the lowest dielectric constant of 2.43. The holes lead to good oil storage performance and the wear rate and the friction coefficient decrease with the increase of porosity. Keywords: polyimide; porous; melamine; dielectric; friction