Electro-Chemical Deposited Cu-Ni Binary and Cu-Ni-Mn Ternary Alloys from Sulphate Bath for Anti-Corrosive Coating Applications in Brine Environment: Effect of Corrosion Behaviour, Polarization Studies, Morphological and Structural Characterizations

Author:

Sharma Shubham1,Dong Xiao Nan2,Wei Peng3,Long Chen4

Affiliation:

1. CSIR-Central Leather Research Institute RCED

2. Wuhan Business University

3. Advanced Science and Engineering Technology Institute

4. Hubei Jiuxi New Material Co., Ltd, Wuhan

Abstract

Electrochemical preparation of binary alloy of Cu-Ni from acid sulphate bath containing citric acid using Potentiostatic method. The effects of alloy composition were monitored. Copper is widely used in industry, because of its good thermal conductivity and mechanical characteristics. The accumulation of Nickel & Manganese to Copper enhances itspotency, vigour, toughness, endurance, permanence&also the corrosion-resistanceas well asattrition. Corrosion controls of metal have technical environmental and economical importance. The Cu-Ni-Mn alloyswere used commercially for decorative and protective purpose and also in marine applications. The thin film coating characterized by SEM, EDAX and XRD shows morphological, compositional and structural properties of alloys respectively.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference15 articles.

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2. Kunifer 10 & other trade literature YIA-IMI York shire imperical alloys.

3. A.H.L. Chamberlain, B.J. Garner, The influence of iron content on the bio-fouling resistance of 90/10 copper‐nickel alloys. Bio-fouling-The Journal of Bio-adhesion and Bio-film Research, Vol. 1(1), pp.79-96, (2009).

4. G.Blunn, Biological Fouling of Copper and Copper Alloys, 6thInternational Biodeterioration symposium, Washington, D.C.,p.567 (1984).

5. A.D. Sneddon, D.Kirkwood, The influence of fouling upon corrosion rates of steels and copper-nickel alloys in seawater, Construction and Building materials Vol.3 (1), pp.35-39(1989).

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