Affiliation:
1. National Kaohsiung University of Science and Technology
Abstract
This study is designed to investigate the influence of multi-beam matrix laser cutting process on NAND Flash package quality, and find out the important process parameters of multi-beam matrix laser process are defocus amount, laser power, cutting speed and material thickness. Then use the finite element analysis software ANSYS to obtain the minimum temperature influence, stress and strain, and use Taquchi method and variance analysis (ANOVA) to find the optimal temperature combination, the optimal combination of stress and strain and its contribution degree. Finally, the reliability is tested by verification experiments, and the error is found to be within 3.638%. It is confirmed that the optimized parameter combination has high repetitiveness. It is hoped that this study can contribute to the multi-beam matrix laser cutting process.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference15 articles.
1. R.M. Lumley, Controlled separation of brittle materials using a laser, The Bulletin of the American Ceramic Society, 48(9), pp.850-854, (1969).
2. E. Lambert, J.L. Lambert, B. De Longueville, Severing of glass or vitrocrystalline bodies, US Patent 3, 935, 419, (1976).
3. Yasuhiro Akiyama, Katsumi Midorikawa, Yuuki Matsunawa, Yutaka Nagata, Minoru Obara, Hideo Tashiro, and Koichi Toyoda, Generation of high-order harmonics using laser-produced rare-gas-like ions, Phys. Rev. Lett. 69, 2176-Published 12 October (1992).
4. K. Li and P. Sheng, Plane stress model for fracture of ceramics during laser cutting, International Journal of Machine Tools and Manufacture, 35(11), p.14, (1995).
5. T. Kurobe, M. Noguchi, and T. Matsumoto, Precision breaking of a silicon wafer by YAG Laser - double irradiation breaking assisted by mirror surface cooling, The Japan Society for Precision Engineering, 62(1), pp.95-99, (1996).