Affiliation:
1. Hubei University of Technology
2. HuaZhong Agricultural University
3. Hang Zhou Dianzi University
4. HuaZhong University of Science & Technology
Abstract
Undeformed chip thickness is one of the most important parameters in grinding process, which is related to the entire abrasive grains in grinding simultaneously and changed periodically with time. Simplifying the geometric shape of abrasive grains ,the paper modifies the mathematic models of undeformed chip thickness by analytic method, establishes an universal calculation model of grinding force based on undeformed chip thickness, then optimizes the parameters of the model by restrictive random direction method according to the measuring experiments of the inter-grain spacing about CBN electroplated wheels and the grinding experiments of steel 55 during surface grinding, analyses the influence factors of the friction ratio on the grinding force. The results show that under the same grinding depth， both of the ratio and the grinding force will be decreased with the increase of velocity ratio VS/VW, but the ratio increases and the grinding force decreases with the increase of inter-grain spacing.
Publisher
Trans Tech Publications, Ltd.
Reference5 articles.
1. S. Malkin: Grinding technology：Theory and applications of machining with abrasives. Ellis Horwood Limited, New York. (1989).
2. H. Tönshoff, J. Peters, I. Inasaki , T. Paul: Modeling and simulation of grinding processes. Annals of the CIRP Vol. 42(1992), p.677.
3. R.L. Hecker, S.Y. Liangm, X.J. Wu, P. Xia, D.G.W. Jin: Grinding force and power modeling based on chip thickness Analysis, Int J Adv Manuf Technol Vol. 33(2007), p.449.
4. L.J. Li , J.C. Fu: A Study of Grinding Force Mathematical Model. J. Mech. Eng. Vol. 17(1981), p.31. (in Chinese).
5. R.P. Upadhyaya , J.H. Fiecoat: Factors Affecting Grinding Performance with Electroplated CBN Wheels. CIRP Annals – Manuf. Technol., Vol. 56( 2007), p.339.
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献