Affiliation:
1. Technical University of Cluj-Napoca
Abstract
The paper presents a study about thermal behavior of heat sink - power thyristor assembly. The models of power thyristor and the model of heat sink were modeled in SolidWorks. These models have been used in simulations. We take into consideration different conductor materials for heat sinks and different thermally conductive pastes. A thermal analysis has been performed for different places of power module on heat sink. In our study, we have taken into consideration the influence of the different materials of heat sink in heat dissipations. The results of performed simulations realized with Solid Works are presented in the paper.
Publisher
Trans Tech Publications, Ltd.
Cited by
1 articles.
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