Transient Methods and their Usage for Flour Thermophysical Parameters Measurement

Author:

Božiková Monika1,Hlaváč Peter1

Affiliation:

1. Slovak University of Agriculture in Nitra

Abstract

This article focuses on temperature relations of selected thermophysical parameters for three different types of wheat flour. The main objective of experiment was to determine the thermal conductivity, thermal diffusivity and volume specific heat of wheat flour produced in Slovakia. Measurements were performed in laboratory settings. Thermal parameters were measured by the thermal analyser Isomet 2104 with two types of probes – a linear probe and plane probe. Measurement by the linear probe is based on the hot wire method, and measurement by the plane probe is based on the extended dynamic plane source method. Both methods are described in the text. Two types of measurement methods were used because of the non-homogenous structure of measured material. All thermophysical parameters were measured during the temperature stabilisation in the temperature interval 5–24 °C. Obtained graphical relations had linear increasing progresses with high values of determination coefficients in all cases.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference10 articles.

1. Ľ. Kubík, Micro-structure fractal analysis of apple flesh of cultivars pinova, PTEP – Journal on Processing and Energy in Agriculture, 11(3) (2007) 102–105.

2. M. Božiková, P. Hlaváč, Selected physical properties of agricultural and food materials, SUA in Nitra, Nitra, (2010).

3. M. Božiková, Selected thermophysical characteristics of milk and milk products, Acta Technologica Agriculturae, 11(1) (2008) 15–19.

4. H. S. Carslaw, J. C. Jaeger, Conduction of heat in solids, 2nd ed., Oxford University Press, London, (1959).

5. E. Karawacki, B. M. Suleiman, I. Ul-Hang, B. T. Nhi, An extension to the dynamic plane source technique for measuring thermal conductivity, thermal diffusivity and specific heat of solids, Review of Scientific Instruments, 63 (1992) 4390–4397.

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