Study of DGEBA and Novolac Adhesive Solutions between Ceramic and Steel Substrates

Author:

Gaussens Clélia1,Nassiet Valérie1,Hassoune-Rhabbour Bouchra1

Affiliation:

1. Ecole Nationale d’Ingénieurs de Tarbes

Abstract

The industrial application (under a confidential clause) concerns a ceramic/steel assembly. This PhD research is concerned with providing a reliable industrial bonding between ceramic and steel using structural adhesive. This industrial joint shall withstand a wide range of temperatures with brutal thermal changes. This paper focuses on the adhesive formulation. Indeed, we needed to compromise the adhesive flexibility: soft enough to resist the thermal stresses and compensate the coefficient of thermal expansion mismatch between the two substrates. We find this good compromise with DGEBA and Novolac epoxy based adhesive separated or blended. The influence of the different formulation parameters on the initial properties was studied by chemical, rheological and thermal tests on adhesive samples. Depending on those formulations, we observed different behaviours in term of glass transition temperature, cross-linking time and flexibility.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference29 articles.

1. A.D. McNaught, A Wilkinson, Compendium of chemical terminology, IUPAC recommendations (1997).

2. C. Barrère and F. Dal Maso, Revue de l'institut français du pétrole, Vol. 52, n°3, PP 317-335 (1997).

3. J.P. Pascault and al., Thermosetting polymer, PP 25-32 (2002).

4. M.A. Boyle and al., Epoxy resin. Composites Compendium, ASM Handbook (2003).

5. I.K. Varma, V.B. Gupta, Comprehensive composite materials Vol. 2, (2000).

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3