Electromagnetic Micro-Punching Process of T2 Copper Foil

Abstract

Electromagnetic micro-punching is a novel micro-punching process in which metal foil occur plastic deformation until shear fracture under magnetic impact load. In this paper, electromagnetic micro-punching process was investigated on T2 copper foil. Effects of discharge energy, foil thickness and discharging time on micro punching were discussed. The results show that micro holes were successfully pierced with the discharge energy more than 5.0 kJ on copper foil of 20 μm in thickness. Foil thickness is the main factor in electromagnetic micro-punching with the discharging energy of 7.2 kJ. In addition, increasing discharging time can punch micro hole on thicker foil. The micro holes with diameter of 0.4-1.4 mm were successfully punched on 20 μm copper foil in thickness with discharge energy of 7.2 kJ.