New Development of Contact Probe and Methodology

Abstract

We present a new type of wafer probe card with resin film consisting of two beams. Resin film is embedded on both sides of the probe beam, having a thickness of 4 [μm] and made from polyimide. This proposed probe enables compliant structures with large overdrive to ensure high durability of the structure and controllable scrub motion to assure cleaning process. In this study, Matrix method is introduced for theoretical studies of the probe structure and commercial finite element code is used. Electrical contact resistance is determined by theoretical studies based on Holm's theory and experimentally by　our measurement instrumentation respectively. The structure is proven theoretically to get appropriate scrub motion when it undergoes a large overdrive with preferable exhibited contact force. Moreover, all of these mechanical characteristics can be varied to know the values of the character of probes. The methodology having one of the most preferable characters of the contact-probe had been achieved.