3.3 kV-10A 4H-SiC PiN Diodes

Author:

Brosselard Pierre1,Camara Nicolas2,ul Hassan Jawad3,Jordá Xavier4,Bergman Peder3,Montserrat Josep4,Millan José4

Affiliation:

1. Université de Lyon

2. Campus Universidad Autonóma de Barcelona

3. Linköping University

4. IMB-CNM, CSIC

Abstract

An innovative process has been developed by Linköping University to prepare the 4HSiC substrate surface before epitaxial growth. The processed PiN diodes have been characterized in forward and reverse mode at different temperature. The larger diodes (2.56 mm2) have a very low leakage current around 20 nA @ 500V for temperatures up to 300°C. A performant yield (68%) was obtained on these larger diodes have a breakdown voltage superior to 500V. Electroluminescence characteristics have been done on these devices and they show that there is no generation of Stacking Faults during the bipolar conduction.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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