Development of a Polishing Disc Containing Granulated Fine Abrasives-Reference-Cited by-同舟云学术

Development of a Polishing Disc Containing Granulated Fine Abrasives

Published:2003-04 Issue: Volume:238-239 Page:257-262
ISSN:1662-9795
Container-title:Key Engineering Materials
language:
Short-container-title:KEM

Author:

Nakamura Hiroki¹,Yan Ji Wang²,Syoji Katsuo,Wakamatsu Y.³

Affiliation:

1. Denso Corporation

2. Keio University

3. Kyushu Institute of Technology

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.scientific.net/KEM.238-239.257.pdf

Reference5 articles.

1. Ceramics processing seminar: Precision processing of fine ceramics, Industrial Investigation Magazine, (1990) p.215.

2. J. Ikeno: Fixed fine abrasive polishing of silicon wafer, Journal of the Japan Society for Grinding Engineering, Vol. 44 (2000) p.433.

3. H. Noguchi, Y. Abe, K. Tyou, T. Nakagawa: On the manufacture of fine grain silica wheel, Proceedings of the Japan Society for Precision Engineering 1994 Spring Meeting (1994) p.511.

4. K. Tyou, H. Oguchi, T. Nakagawa: Mirror surface grinding by fine grain silica wheel, Proceedings of the Japan Society for Precision Engineering 1994 Spring Meeting (1994) p.513.

5. Y. Nakano: Attraction of the gel form learned from the salmon roe, Journal of the Japan Society for Chemistry and Education, Vol. 48 (2000) p.36. Fig. 5 Relation between polishing time and finished surface roughness.

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