Effect of Mold Temperature on Surface Segregation of Continuous Unidirectional Solidified Cu-Ag Alloy

Author:

Luo Ji Hui1,Xiang Li Juan1,Gan Xun1,Han Sun1,Deng An Lin1,Zhang Ling Ling1

Affiliation:

1. Yangtze Normal University

Abstract

The Cu–3%Ag alloy was prepared by continuous unidirectional solidification technique. The composition distribution of continuous unidirectional solidification Cu–3%Ag alloy was analyzed. The effect of different mold temperatures on the composition distribution of alloy was studied. The results show that when the mold temperature is low, continuous unidirectional solidification Cu–3%Ag alloy has surface segregation. The morphology of segregation phase mainly presents stripe and water drop shape. When the mold temperature is high, the surface segregation begins to decrease and eventually disappear.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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