Analysis of Interfacial Bonding Strength and Microstructure of Rolled Clad Plates

Abstract

The effects of rolling deformation on the interface bonding strength and microstructure of bimetallic clad plates were simulated. The composition and sub-structure of the interface were analyzed by electron probe micro-analyzer (EPMA) and transmission electron microscope (TEM). The results showed that the interfacial bonding strength of clad plates was significantly depend on the deformation process, and the bonding time was also a significant factor on bonding effect apart from total strain in the two-stage rolling. Chromium, nickel and other alloying elements have a significant diffusion zone at the bonding interface with a diffusion width of about 10µm. High resolution TEM analysis confirmed that there was an sound metallurgical bonding at the interface, and the structure of martensite in transition zone and matrix approximately meet the coherent relationship of(200) Ferrite // (111) Martensite and [020] Ferrite // [211]Martensite.