A Simulation-Based Approach to Predict the Springback Behavior of Ultra-High Strength Spring Strips

Author:

Richter Karsten1ORCID,Reuther Franz1,Müller Roland2

Affiliation:

1. Fraunhofer Institute for Machine Tools and Forming Technology IWU

2. Fraunhofer-Institute for Machine Tools and Forming Technology IWU

Abstract

One effect of high influence on the dimensional accuracy during bending is springback. It inevitably occurs due to the elastic proportion in the material behavior. The impact is notably high when producing springs made of ultra-high strength spring strips of the steel grade 1.4310 (X10CrNi18-8). The high yield ratio needed to fulfil the functionalities required during application leads to dimensional inaccuracies that have to be compensated during the production process. This paper reports a simulation-based approach to predict the springback behaviour of ultra-high strength spring strips with tensile strengths TS = 1500-1800 MPa. Based on the results of advanced material testing and modelling, the numerical prediction of the springback behavior of an exemplary bending process (free bending) has been investigated in detail. This helps to obtain deeper knowledge and understanding of the springback phenomenon and to achieve suitable strategies for a more efficient industrial tool and process design while processing ultra-high strength spring strips.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Punching of Ultra-High-Strength Spring Strips: Evolution of Cutting Edge Radius up to 1,000,000 Strokes for Three Punch Materials;Journal of Manufacturing and Materials Processing;2022-03-19

2. Prediction and Compensation Algorithm of Variable Curved Surface in Multi-point Forming;Advances in Intelligent Systems and Computing;2020-12-18

3. Springback Modification for Biaxial Bending Plate and Its Validation in Multi-point Forming;Data Processing Techniques and Applications for Cyber-Physical Systems (DPTA 2019);2020

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