Affiliation:
1. The Ural Federal University named after the First President of Russia B. N. Yeltsin
Abstract
The process of copper regeneration from spent hydrochloric acid etching solution of printed circuit boards is considered. A combined scheme is proposed, which includes the preliminary removal of excess chlorine ions from the solution, using a highly basic anion exchange resin and the subsequent electrochemical precipitation of copper. A solution contents, g/dm3: 237 Cu, 27 NH4Cl, 11.6 HCl was used. Electrical extraction was performed at a current density of 650 A/m2. The method makes it possible to prevent the emission of chlorine at the anode and ensures the obtaining copper as metal.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference21 articles.
1. Raymond H. Clark Handbook of Printed Circuit Manufacturing, Springer Science & Business Media, (2012).
2. Yu M, Zeng X, Song Q, Liu L, Li J, Examining regeneration technologies for etching solutions: a critical analysis of the characteristics and potentials, Journal of Cleaner Production (2015).
3. Bell, P., Sauder, D.G., Paredes, J.E.B., Using Etching, Electroplating and Lithography as a Laboratory Sequence in Chemistry of Art and Nanotechnology Themed Physical Science Courses. Journal of Laboratory Chemical Education. 1 (2013) 49-53.
4. Chuan, L.W., Zakaria, N.B., Stephan, M., 2013. Novel approach in selective area chemical etching of copper metallization for electrical failure analysis, Physical and Failure Analysis of Integrated Circuits (IPFA), 20th IEEE International Symposium on the. IEEE, (2013) 162-165.
5. Mei, Y., Lu, G.-Q., Chen, X., Gang, C., Luo, S., Ibitayo, D., Investigation of post-etch copper residue on direct bonded copper (DBC) substrates. Journal of electronic materials. 40 (2011) 2119-2125.
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献