Literature Review of Gallium: Conductive Ink Alternative?

Author:

Aguilar-Banegas Alejandro David1,Reyes-Cruz Fredy David1,Vargas-Pineda Jesús Antonio1,Ortega-Jimenez Cesar Humberto1

Affiliation:

1. Universidad Nacional Autónoma de Honduras (UNAH)

Abstract

Although there are currently different applications for gallium in microelectronics, literature is sparse about its applications in the area of conductive inks. The important characteristics to consider from the ink are viscosity, corrosion and surface tension. The importance of viscosity is a critical parameter in the printing ink mixture, which requires a metal to fulfill the function of conductor, such as gold, copper, and silver. Gallium as a conductor replacement is proposed due to the high cost of such metals currently used. The valence electrons are discussed in this paper due to the direct relation that has with metal conductivity, to provide a justified analysis about gallium application in conductive ink. The application of gallium could mean a significant change in conductive ink elaboration process. Thus, the aim of this research is to analyze the application of gallium as conductive ink, which is done by a literature review on gallium as a semi-conductor because of his valence electrons. Results about gallium as a potential conductive ink show that there is evidence that gallium shares similar properties as the current of materials conductive inks being adopted. This first literature review has some implications on the potential use of gallium as a conductive ink, requiring further experimental research to better test for conducting efficiency.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. MXene-Based Ink Design for Printed Applications;Nanomaterials;2022-12-06

2. Study on Direct Writing of Gallium Metal for the Flexible Sensor;Advances in Materials Science and Engineering;2021-10-06

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