Properties and Fabrication of Alumina Dispersion Strengthened Copper Alloy with High Softening Temperature

Author:

Han Sheng Li1,Qin Xiao Dong1,Cai Yi Xiang1,Luo Kai1,Xie Huan Wen1,Li Da Ren1

Affiliation:

1. Guangzhou Research Institute of Nonferrous Metals

Abstract

Cu-Al2O3 alloy combine both high electronic conductivity and high softening temperature. Cu-Al2O3 alloy was fabricated by internal oxidation and hot extrusion methods in the present investigation. Microstructure and properties of Cu-Al2O3 alloy was studied. The influence of preparation parameters, hot extrusion parameters and heat treatment on the properties of the alloy was investigated. The results indicated that the grain of the alloy was very small with a size between 2-10μm. Softening temperature of the Cu-0.6% Al2O3 alloy and Cu-1.0% Al2O3 alloy was 900. Cu-0.6%Al2O3 alloy and Cu-1.0% Al2O3 alloy meeting the requirements for electrode in resistance welding is the ideal substitution of the traditional electrode materials for resistance welding.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference8 articles.

1. Han Shengli, Tian Baohong, Liu Ping. Development of Oxide Dispersion-Strengthened Copper- based Composites for Electrode of Spot Welding[J]. Journal of Henan University of Science and Technology (Nature Science), 2003; 24(4): 0016-0019.

2. Lu Yanjie. Microstructure and Properties of Oxide Dispersion Strengthened Copper Alloys[D]. Beijing: General Research Institute for Nonferrous Metals, 2006: 1-28.

3. Cao Xiangjie, Li Nana. The effect of internal oxidation treatment on properties of Al2O3 particles in dispersion strengthed oxygen-free copper powder and the micro hardness of the powder[J]. Mining Engineering , 2002; 22(2): 101-103.

4. Huang Peiyun. Powder metallurgy principle[M]. Beijing: Metallurgical Industry Press. 1997, pp.370-442.

5. Han Shengli. Tensile Behavior of Al2O3 dispersive Strengthened Copper-based Composite at Elevated temper- ature[D]. Luoyang: Henan University of Science and Technology. 2004: 45-70.

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