Affiliation:
1. University of Las Palmas de Gran Canaria
Abstract
Elecform3DTMis a analysis and simulation tool of electroforming process, in order to facilitate design and manufacturing tasks. Electroforming is an electrolytic process that enables the manufacture of metallic parts with good mechanical properties with a high level of accuracy and reproducibility. In this process a thin metallic shell is deposited on a model part and later released from it. Distribution of deposited metal is not uniform due to current density distribution on the cathode. The results obtained with the first version of this product were very promising, and also indicated the need for a more precise analysis of electrochemical phenomena in this process.The methodology is based on the well-known potentials model of LaPlace, it enables deposited metal distribution prediction with high grade of precision, being experimentally validated with cathodic polarization curves. These boundary conditions at the electrodes serve to combine the existing electrical and chemical effects in the process. On the active surfaces of the electrodes the current density is a function of the nonlinear laws of polarization in the electrode-electrolyte interface. Analytically the resolution of these problems is totally unworkable, at least for real geometries, so it is used for solving the employment of numerical methods. The resolution has been considered using the boundary element method (BEM), because we are only interested in obtaining the solution on the surface of the cathode. Elecform3DTMis an important step beyond electroforming so far, and combined with almost all additive manufacturing 3D printer, is a cheaper alternative for high quality metallic parts manufacturing in comparison with other Rapid Manufacturing technologies.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference15 articles.
1. R. Mouton, Electroplating Thickness variation œ Fact and Fiction, EIMC, Laguna Niguel, CA. (2005), 93-124.
2. J. Dini, Electrodeposition. Materials Science of Coating and Substrates. Berkshire, UK, Noyes Publications, (1993).
3. J. Dukovic, Computation of Current Distribution in Electrodeposition, a review, IBM Journal of research and Development, 34 (5), (1990), 693-705.
4. R. Alkire, T. Bergh, T.L. Sani, Predicting Electrode Shape Change with Use of Finite-Element Methods. J. Electrochem. Soc. 125, (1978), 1981–(1988).
5. Prentice, G.A., Tobias, C.W., Simulation of changing electrode profiles. J. Electrochem. Soc. 1, (1982), 76–85.
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