Hybrid Nanocomposites – A Review

Author:

Koilraj T. Thomas1,Kalaichelvan K.1

Affiliation:

1. Anna University

Abstract

Since the last ten years, research happenings in the field of nanomaterials have been increased dramatically. Materials scientists and researchers have realized that the mechanical properties of materials can be altered at the fundamental level, i.e. at the atomic-scale. Carbon nanotubes have been well recognized as nanostructural materials that can be used to modify mechanical, thermal and electrical properties of polymer-based composite materials, because of their excellent properties and perfect atom arrangement. In geneal, scientific research related to the nanotubes and their co-related polymer based composites can be distinguished into four particular scopes: (i) production of high purity and well-regulated nanotubes, in terms of their size, length and chiral arrangement; (ii) enhancement of interfacial bonding strength between the nanotubes and their surrounding matrix; (iii) control of the dispersion properties and alignment of the nanotubes in nanotube/polymer composites and (iv) applications of the nanotube in real life. Research shows that addition of resin with nanoclays permits to retain stiffness without losing toughness, and also improving barrier and thermal properties. Dynamic Mechanical Analysis (DMA) studies revealed that filling the carbon nanotube into epoxy can produce a 90% enhancement in storage modulus and a 22°C increase in Tg. Addition of nanoclay and epoxy with nanotubes forms a hybrid nanocomposite.

Publisher

Trans Tech Publications, Ltd.

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3