ESH Friendly Solvent for Stripping Positive and Negative Photoresists in 3D-Wafer Level Packaging and 3D-Stacked IC Applications-Reference-Cited by-同舟云学术

ESH Friendly Solvent for Stripping Positive and Negative Photoresists in 3D-Wafer Level Packaging and 3D-Stacked IC Applications

Published:2012-04 Issue: Volume:187 Page:223-226
ISSN:1662-9779
Container-title:Solid State Phenomena
language:
Short-container-title:SSP

Author:

Suhard Samuel¹,Claes Martine¹,Civale Yann¹,Nolmans Philip¹,Sabuncuoglu Tezcan Deniz¹,Travaly Youssef²

Affiliation:

1. IMEC

2. IMEC VZW

Abstract

NMP is a commonly used solvent for removing positive photoresist in 3D applications, especially in electroplating and (micro-) bumping. However, the negative photoresists are more and more preferred in these applications. Unfortunately, NMP is inefficient for negative photoresist and it is not considered in Europe as an ESH solvent anymore. In this paper a comparative study was carried out in order to identify a solvent that is ESH friendly and a one-size-fits-all solution for stripping negative-tone and thick positive-tone photoresist (2-22 μm) for (micro-) bumping, electroplating and TSV etch applications. The study was performed at tool level.

Publisher

Trans Tech Publications, Ltd.

Subject

Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics

Link

https://www.scientific.net/SSP.187.223.pdf

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