A Descum Review for Cleaning Surfaces in Polymer Embedded Process Flows-Reference-Cited by-同舟云学术

A Descum Review for Cleaning Surfaces in Polymer Embedded Process Flows

Published:2012-04 Issue: Volume:187 Page:215-218
ISSN:1662-9779
Container-title:Solid State Phenomena
language:
Short-container-title:SSP

Author:

Jamieson G.¹,Gerets C.¹,Duval F.C.¹,Pham N.P.¹,Iker F.¹,Funaya T.²,Boullart Werner³

Affiliation:

1. IMEC

2. NEC Corporation

3. IMEC Interuniversity Microelectronics Center

Abstract

In this paper we review the effects of the plasma descum steps used in current process flows for the fabrication of Cu interconnects embedded in polymer, paying particular attention to polymer residues that are not easily removed in a gentle oxygen only plasma.

Publisher

Trans Tech Publications, Ltd.

Subject

Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics

Link

https://www.scientific.net/SSP.187.215.pdf

Reference8 articles.

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2. F. Iker et al , 3D embedding and interconnection of ultra thin (< 20 µm) silicon dies., EPTC 2007 pp.222-226.

3. F. Iker, T. Funaya, G. Jamieson, E. Beyne Alternative patterning techniques enabling fine pitch interconnection on topography, to appear in ECTC June (2010).

4. F. Iker et al. Technology platform for 3-D stacking of thinned embedded dies., ECTC 2008, pp.292-298.

5. T. Funaya, T. Buisson, I. De Preter ,E. Beyne and F. Iker, Ultra thin die embedding technology with 20um-pitch interconnection, to appear in ECTC (2010).

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