Singularity Analysis for Plane Tri-Material Junctions

Abstract

Stress singularities exist on the interface endpoint or internal point, consisting of dissimilar linear elastic bonded wedges. The eigenvalue λ is an important parameter to represent the stress singularity on the interface singular point. And smaller eigenvalue represent stronger stress singularities on the interface singular points. The angular function is another parameter to represent stress singularities around singular points. It is known that the eigenvalue is influenced by the Young’s modulus, Poisson’s ratio and interface angles. The Airy stress eigenfunction method has been used to solve the eigenvalue on the bi- and tri-material junctions by verifying the Young’s modulus. And then talk about angular functions around the bi- and tri-material junctions’ singularity point. At last discuss the feasibility of enhancing the interfacial bonding strength in engineering practice.