The Design and Dynamic Analysis of High Frequency Ultrasonic Transducer for Wire Bonding Application-Reference-Cited by-同舟云学术

The Design and Dynamic Analysis of High Frequency Ultrasonic Transducer for Wire Bonding Application

Published:2012-11 Issue: Volume:226-228 Page:199-202
ISSN:1662-7482
Container-title:Applied Mechanics and Materials
language:
Short-container-title:AMM

Author:

Zhang Zhen¹,Yan Tian Hong¹,Chen Xue Dong²,He Bo³,Xu Xin Sheng⁴

Affiliation:

1. China Ji Liang University

2. Huazhong University of Science and Technology

3. Ocean University of China

4. China Jiliang University

Abstract

The ultrasonic transducer converts electrical energy into mechanical vibration, and its vibration characteristics have a great effect on the bonding quality. Bond grid arrays (BGA) application and the ability to decrease the temperature of the wire bonding process urgently demand higher bonding frequencies. The ultrasonic transducer working at 135 KHz has been designed, simulated and tested. Based on electromechanical equivalent circuit theory, the dimensions of the transducer were designed. Through finite element method (FEM), the dynamic characteristics of the transducer were investigated. The 5th order axial mode of the transducer resonating at 133 KHz is the working mode. The undesirable modes near the working mode have a great influence on the quality of bonding and must be considered carefully in system design. At last, the experimental testing was conducted for verifying the design and simulation results of the transducer.

Publisher

Trans Tech Publications, Ltd.

Link

https://www.scientific.net/AMM.226-228.199.pdf

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