Effect of an Organic Inhibitor in High pH Chemical Rinse on the Platen for Cu-CMP
Author:
Affiliation:
1. ST Microelectronics Crolles2
2. ATMI
3. Philips Semiconductors
4. Freescale Semiconductor
Publisher
Trans Tech Publications, Ltd.
Subject
Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics
Link
https://www.scientific.net/SSP.134.299.pdf
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Comparative evaluation of organic contamination sources from roller and pencil type PVA brushes during the Post-CMP cleaning process;Polymer Testing;2020-10
2. Möhlau’s Anthradipyrazole Revisited: A New Look at an Old Molecular System;Crystal Growth & Design;2013-10-10
3. Low-κ/Cu Cleaning and Drying;Handbook of Cleaning in Semiconductor Manufacturing;2011-02-22
4. Facile Preparation of Polytopic Azoles: Synthesis, Characterization, and X-ray Powder Diffraction Studies of 1,4-Bis(pyrazol-4-yl)- and 1,4-Bis(tetrazol-5-yl)benzene;Chemistry Letters;2008-09-05
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