Effects of the Mould Temperature on the Properties of Graphite/Carbon Fiber/Copper/Phenolic Resin Composites

Abstract

Natural graphite, carbon fiber and copper powder as fillers are incorporated into phenolic resin to fabricate conductive polymer composites by hot compression moulding. The effects of the preparing method and mould temperature on the density, electrical conductivity and hardness of composites are investigated. It is found that the density, electrical conductivity and hardness of composites increase as mould temperature increase from 150 °C to 180 °C. Up to 200 °C, the hardness of composite shows a large decrease. At 170 °C, the density, electrical conductivity and hardness of composites are 1.904 g/cm3, 3.43 × 103S/m and 54 HS, respectively. Oxidation action occurring in the phenolic resin could be the main reason for the large decrease of hardness as temperature increases up to 200 °C.