Affiliation:
1. Shanghai Jiaotong University
2. Tongji University
Abstract
In semiconductor wafer manufacturing, furnaces are mainly used for diffusion and deposition operations. During operations, wherever a furnace becomes available, scheduling the next batch deals with decisions on a batch which operation to process next and how many wafer lots to group the batch. To resolve the mentioned scheduling problem of the furnace where existing multi-products and different due dates, a heuristic dynamic scheduling algorithm called WCRHA (weighted cost rate heuristic algorithm) is presented to minimize the objective value of the waiting cost per unit time based on due date constraints. Simulation results show that the proposed algorithm is valid and feasible. Compared with the previous dynamic scheduling algorithms, it is more efficient in ensuring delivery and reducing completion time.
Publisher
Trans Tech Publications, Ltd.