Study on Polishing Tool Contact Deformation for Large Robotic Aspheric Surface Compliant Polishing

Author:

Chen Wei1,Zhan Jian Ming1,Zhang Min Qing1

Affiliation:

1. Ningbo University

Abstract

Due to the problem of the mutual interaction between the polishing tool system and the control of poses and positions, it is difficult to hybrid-synchronizationally control the polishing force, the posture of polishing tool head and the polishing trajectory. So the article designed a set of compliant tools that take the pneumatic servo system as the control system, which was used for active polishing aspheric surface of Robot. It was to accomplish the Robots self-adaptive control to the posture of the polishing tool as well as to figure out the correlation of the contact deformation between the polishing tool and the work piece surface, which makes a theoretical analysis on dynamic and steady characteristics of the contact deformation of the tool system. It applied the meek and polishing tools to the polishing processing of the rough machining of large aspheric surface samples to obtain the data. According to the statistics, the polishing tools can effectively solve the problem of the mutual interaction between the polishing tool system and the control of poses and positions. It also owns good adaptive ability and its machining aspheric surface quality can achieve nanoscale.

Publisher

Trans Tech Publications, Ltd.

Reference8 articles.

1. C.M. Shang D.M. Zhang J.D. Yang. Study on a New High Efficiency Lapping Method for Aspheric Surface Workpiece[J]. Journal of Mechanical Engineering, 2007, 2007, 18(5): 586-589(In Chinese).

2. H.X. Wang X.Y. Song L.J. Zhang. Development of aspheric surface ultra-precision machine tools[J]. Journal of Mechanical Engineer, 2005, (5): 14-16(In Chinese).

3. Z. Lang C.Q. Li,C. Fu. Research on robot flexible polishing system[J]. Journal of Mechanical Engineer, 2006, (6): 26- 28(In Chinese).

4. J. M. Zhan, M.Q. Zhang. Study on the Edge-forming Mechanism for Aspheric Surface Compliant Polishing[J], Journal of Mechanical Engineering, 2013, 24(12): 1587-1591(In Chinese).

5. Sukhoon Jeong, Sangjik Lee, Boumyoung Park, et al. Mechanical effects of polishing pad in copper electrochemical mechanical deposition for planarization [J]. Current Applied Physics, 2010, 10: 299-304.

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