A Study on the Polishing Mechanism of Silicon Carbide (SiC) Optic Surface

Author:

Fan Di1

Affiliation:

1. Chinese Academy of Sciences

Abstract

This paper studies the polishing mechanism of SiC optic surface; it also introduces the grinding mechanism of ceramic material – indentation fracture model. In this paper, the model of SiC polishing in ideal condition is analyzed and the mechanism of SiC polishing in real state is studied.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference13 articles.

1. Q.D. Wang : Large off-axis aspheric manufacturing technology, PhD thesis2001. 4.

2. M. J. Cumbo, D. Fairhurst, S. D. Jacobs, B. E. Puchebner: Slurry particle size evolution during the polishing of optical glass, Applied Optics, Vol. 34, No. 19, 3743-3755.

3. J.H. Dai Z.M. Ge:. Introduction to inorganic non-metallic materials . edited by Harbin Institute of Technology Press, Harbin China (1999).

4. J. L. Wang, Research on Optical SiC Mirror, postdoctoral reseach report,2002. 6.

5. S. Malkin, T. W. Hwang, Grinding mechanisms for ceramics, Annals of CIRP, 1996, Vol45(2), 569-580.

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