Affiliation:
1. Henan University of Science and technology
Abstract
Stress migration behaviors in Tungsten (W) films were investigated according to morphological characteristics and residual stress analysis. Results show that stress relaxtion induced formation of voids and hillocks strips, which resembles the void / hillock pair observed in Cu film electromigration experiments. Analysis indicate that the formation of chocolate sphere shaped W hillocks is intimately related to the atoms diffusivity.
Publisher
Trans Tech Publications, Ltd.
Reference19 articles.
1. J. Klema, R. Pyle, E. Domangue, IEEE, Proceedings of the 22th International Reliability Physics Symposium, Las Vegas, NV, USA, April 3-5, 1984, p.1.
2. J. Curry, G. Fitzgibbon, Y. Guan, R. Muollo, G. Nelson, A. Thomas, IEEE, Proceedings of the 22nd International Reliability Physics Symposium, Las Vegas, NV, USA, April 3-5, 1984, p.6.
3. W. M. Kuschke and E. Arzt: Appl. Phys. Lett. Vol. 64 (1994), p.1097.
4. R. M. Keller, S. P. Baker and E. Arzt: J. Mater. Res. Vol. 47 (1999), p.415.
5. S. Park and S. Suresh: Acta Mater. Vol. 48 (2000), p.3169.
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献