Affiliation:
1. Saitama Institute of Technology
Abstract
This paper is mainly a study the diffusion bonding of 3Y-TZP/SUS440 by using the chemical bonding method. In the bonding interface of 3Y-TZP and SUS440, the Ti-Cu (brass) powder/sheet was used as bonding materials. After bonding process, multi-alloy field with Fe-Ti and Fe-Cu have been confirmed by EPMA determination. Through the microstructure observed by AFM and SEM, bonding boundaries of 3Y-TZP/SUS440 by Ti-Cu powder/sheet had good formation. The distribution of the residual stress on near interface was measured by XRD method. By using of these results, the mechanism of the ceramic and stainless steel was discussed.
Publisher
Trans Tech Publications, Ltd.
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