Molecular Dynamics Simulation of Ni/Cu Epitaxial Thin Film Growth

Author:

Liu Zhi Qiang1,Li Jie2,Zhou Nai Gen1,Wei Jian Ning3

Affiliation:

1. Nanchang University

2. The First Aeronautical Institute of Air Force

3. Jiujiang University

Abstract

In this paper, the growth process of Ni deposited on the Cu() surface at 300K and 700K was simulated by molecular dynamics. The impact of the substrate temperature on the growth pattern and structure of thin film was investigated. The simulation results show that, at the higher substrate temperature, the surface of thin film is smoother and the growth pattern of thin film is two-dimensional layer, however, at the lower temperature, the growth mode of thin film is three-dimensional island.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

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