Characterization of the Response of Embedded Thermocouples in Grinding

Author:

Pombo Inigo1,Sánchez Jose Antonio1,Ortega N.1,Izquierdo B.2,Plaza S.1

Affiliation:

1. University of Basque Country

2. Faculty of Technical Engineering of Eibar

Abstract

Temperature measurement in grinding has been a widely analyzed field in the study of the process. Temperatures in grinding are too difficult to measure due to the high gradients in the ground workpiece. A lot of different methods have been employed by many researches in the last years. In this paper the use of thermocouples is analyzed attending to the mathematical characterization of their response. It will be shown that correct modeling of the thermocouple’s response permits the avoidance of the problem of thermal inertia, making thus possible the use commercial thermocouples for temperature measurement in grinding.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Investigation of the grinding temperature and energy partition during cylindrical grinding;The International Journal of Advanced Manufacturing Technology;2018-05-02

2. Measurement of grinding temperatures using a foil/workpiece thermocouple;International Journal of Machine Tools and Manufacture;2012-07

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