The Creep of Nanocrystalline Metals and its Connection with Grain Boundary Diffusion
Author:
Affiliation:
1. Chinese Academy of Sciences, Institute of Solid State Physics
2. Chinese Academy of Sciences, State Key Laboratory for RSA
3. Chinese Academy of Sciences
Publisher
Trans Tech Publications, Ltd.
Subject
Condensed Matter Physics,General Materials Science,Radiation
Link
https://www.scientific.net/DDF.188-190.45.pdf
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3. Mechanical properties of nanocrystalline materials;Progress in Materials Science;2006-05
4. Analysis of diffusional stress relaxation in submicron Cu interconnect structures using the model with enhanced vacancy diffusivity in grain boundary region;WIT Transactions on The Built Environment, Vol 85;2006-04-20
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