Optimization of the Solder Joints of an Electronic Card Using Heuristic Algorithm

Abstract

In this paper, a new hybrid method of optimization by the heuristics algorithms to evaluate the reliability of the electronic card by simulating its thermo-mechanical behavior is presented. A model of simulation by finite element is developed to consider the maximal deformations due to temperature; a mechanico- computing coupling is used to find the optimal structure. Embedded electronic systems are playing a very important role in several areas, such as in automotive, aerospace, telecommunications and medical sectors. To properly perform their functions, electronic systems must be reliable [18].This powerful and robust algorithm which is based on hybridization of Differential Evolutionary algorithm with Particle Swarm Optimization (PSO) gives performance results [7].