Effects of Elements on Mechanical and Electronic Properties of Ag from First-Principles Calculations

Author:

Ruan Hai Guang1,Huang Fu Xiang1,Zhong Ming Jun1,Wu Bao An2,Tang Hui Yi2,Luo Wei Fan2

Affiliation:

1. Chongqing University of Technology

2. Chongqing Materials Research Institute Co., Ltd.

Abstract

The first-principles calculations were performed to research effects of elements X (Au, Be, Pd, Y, Ca, Cu, In and Zn) on mechanical and electronic properties of Ag with the density function theory (DFT). A supercell consisting of 107 atoms of Ag and one solute atom X was used. It was found that the bulk modulus of Ag dilute solutions were affected by the bulk modulus of pure alloying elements as well as their volume. The shear modulus G trend to decrease with increase of volume of Ag caused by alloying addition, but Ag-X covalent bond had positive correlation with shear modulus G. All of Ag107X alloys were ductility since theirs B/G ratio, Poisson's ratios ν were larger than 1.75 and 0.33, respectively. Comparing to other calculated Ag107X alloys, Ag107Be and Ag107Cu had the larger Vickers hardness, the value of which were 3.96GPa, 3.86GPa, respectively. There were not only metallic bonds (Ag-Ag) but also covalent bonds (Ag-X) in Ag107X alloys. The strong covalent bonds between Y, Zn, Ca and Ag were mainly caused by orbital hybridization between Y-5p orbital, Zn-3d orbital, Ca-3d orbitals and Ag-4d, 5s and 5p orbitals.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference20 articles.

1. A. Reti, Silver: Alloying, Properties and Applications, Encyclopedia of Materials Science & Technology 23 (2001) 8618-8621.

2. D. X. Li,. Precious metal material science. Central south university of technology press, Changsha,(1991).

3. J. R. Davis, Metals handbook: desk edition, ASM International, (1998).

4. C. J. Pu, M. Xie, W. J. Du, Research Development of Precious Metal-based Electric Contact Materials, Mater. Rev. 28(2014) 22-25.

5. J. K. Liao, Y. H. Liang, W. W. Li, Y. C. Men, Silver alloy wire bonding, Electronic Components and Technology Conference. IEEE, 282(2012) 1163-1168.

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