Effect of Ultrasonic Vibration Assisted Grinding Process on Surface Topography and Properties of C/SiC Composite

Author:

Wang Yan1,Lin Bin2,Ding Yan Yu1,Fu Zhi Qiang1,Zhang Xiao Feng2,Dong Ying Huai1

Affiliation:

1. Tianjin University of Science and Technology

2. TianJin University

Abstract

This paper study on the influence of ultrasonic vibration assisted grinding (UAG) process on surface topography and properties of C/SiC composites. Through the surface quality experiments of common grinding (CG) and UAG, the height distribution parameters and function parameters are obtained and used to analyze the characteristics of the material surface topography. The relationship between grinding process and the composites surface quality is pointed out by experimental research. The orthogonal design is employed to optimize ultrasonic parameters and grinding parameters. The optimized condition is carried out to modify the surface quality. The results show that ultrasonic vibration has a great influence on height and surface bearing properties; the surface roughness is improved by the small vibration amplitude and low frequency. The grinding depth is the key factor on surface topography modification and the feed rate is the second. According to the research, an important technical support is carried out to improve the surface performance of C/SiC composites.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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