Affiliation:
1. Hunan Institute of Science and Technology
Abstract
The paper used indentation fracture mechanics model or cutting model to deal with the grinding removal mechanism of nanostructured ceramic coatings, the interaction between the abrasive grains and the workpiece was approximately regarded as ideal small-scale indentation phenomenon, it was used to evaluate the surface quality in ceramic machined processing that formation of grinding crack and its propagation process, the material removed process and the surface defects of the ceramic grinding, the cutting model proved that although the removed material is usually brittle removal, most of the grinding energy consumption was related with plastic deformation.
Publisher
Trans Tech Publications, Ltd.
Reference5 articles.
1. Agarwal, Sanjay, Venkateswara Rao. Predictive modeling of undeformed chip thickness in ceramic grinding. International Journal of Machine Tools & Manufacture, May2012.
2. Zhang B. Surface Integrity in Machining Hard-brittle Materials. Journal of Japan Society for Abrasive Technology, March2010.
3. Zhou Hongxiu, Wang Chunmei, ZhaoDongjie. Nanogrinding of soft-brittle monocrystalline mercury cadmium telluride using a ceramic bond ultrafine diamond grinding wheel. International Journal of Advanced Manufacturing Technology, Jun2012.
4. Youngsik Choi. A Comparative Study of Residual Stress Distribution Induced by Hard Machining Versus Grinding. Tribology Letters, Dec2009, Vol. 36.
5. Liu Weixiang. Apr2012, In Chinese.
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献