Affiliation:
1. Guilin University of Technology
2. Guilin University of Electronic Technology
Abstract
The reflow soldering process under infrared hot air environment was simulated based on a typical BGA SMA and a twelve-zone reflow oven. Then the optimal soldering process parameters were obtained based on 6σ analysis method and related software. The results could be used to direct the lead-free soldering process parameters setting, and the soldering quality was ensured effectively.
Publisher
Trans Tech Publications, Ltd.
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