Solder Based Self-Assembled Structures for 3D Integration

Abstract

A novel way of three dimensional (3D) chip stacking has been designed in a view to improve heat dissipation across the layers. Chip stacking using vertical interconnections forms microscale channels for coolant to circulate through the gaps. Solder-based self-assembled (SBSA) 3D structures have been designed as posts on simulated through silicon vias (TSVs) to prove the processing concept. The processing of SBSA structures using a low temperature solder alloy and dip soldering method is described. Additional processing steps to fabricate interconnected 3D structures were demonstrated. Mechanical grinding of the 3D structures shows that soldered SBSA structures were void free and robust enough to be used as a connection post for chip stacking. SBSA structures provide a solder bump that serves as a connection path in the integration of dissimilar electronic technologies. Conventional copper posts, developed in a previous project, can be an effective approach to integrated circuit (IC) stacking. However, the SBSA post provides more variety in size and shape with a potential to serve as a reservoir for solder to aid in chip bonding. The solder bumps are heat resistant and uniform thicknesses were obtained across a large array of SBSA structures. The electrical durability of SBSA posts were determined by completing I-V measurements after thermal treatments. Fabricated SBSA posts were subjected to thermal cycling with temperatures ranging from room temperature to 300 °C. The interconnected SBSA posts are shown to be stable until 165 °C with little variation in measured resistance.