Investigation of Intermetallic Phase Formation and Structural Analysis in Annealed Al/Cu Bilayer Thin Films-Reference-Cited by-同舟云学术

Investigation of Intermetallic Phase Formation and Structural Analysis in Annealed Al/Cu Bilayer Thin Films

Published:2013-12 Issue: Volume:845 Page:221-225
ISSN:1662-8985
Container-title:Advanced Materials Research
language:
Short-container-title:AMR

Author:

Halim Zulhelmi Alif Abdul¹,Yajid Muhammad Azizi Mat¹,Rosli Zulkifli Mohd²,Ali Riyaz Ahmad Mohamad³

Affiliation:

1. Universiti Teknologi Malaysia

2. Universiti Teknikal Malaysia Melaka

3. Universiti Tun Hussein Onn Malaysia

Abstract

The growth of intermetallic phases in Al/Cu bilayers thin film having 2/3 layer thickness ratios were characterized by X-ray powder diffraction (XRD), energy dispersive X-ray (EDX) and transmission electron microscopy (TEM). In annealing temperature of 200 °C, the growth is controlled by Cu diffusion which resulted to formation of θ-Al2Cu, η-AlCu, ζ-Al3Cu4 and γ-Al4Cu9 phase.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Link

https://www.scientific.net/AMR.845.221.pdf

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