Simulation, Fabrication and Characterization of 6500V 4H-SiC JBS Diode

Author:

Huang Run Hua1,Tao Yong Hong2,Chen Gang1,Bai Song1,Li Rui2,Li Yun1

Affiliation:

1. Science and Technology on Monolithic Integrated Circuits and Modules Laboratory

2. Nanjing Electronic Device Institute

Abstract

4H-SiC JBS diode with breakdown voltage higher than 6.5 kV has been successfully fabricated on 4H-SiC wafers with epitaxial layer. In this paper, the simulation, the fabrication, and the electrical characteristics of 4H-SiC JBS diode were reported. The drift layer thickness and doping are 55 μm and 9×1014cm3respectively. 60 floating guard rings edge were fabricated as termination. The on-state voltage was 4 V at JF= 7A.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference5 articles.

1. P. Brosselard, X. Jorcld, M. Vellvehil: Power Semiconductor Devices and ISPSD'07pages285-288.

2. J. Millan and P. Godignon: Electron Devices (CDE), 2013 Spanish Conference on pages 293-296.

3. Baliga.B. J: Electron Device Letters Vol. 8 pages 407-409.

4. J.H. Zhao, P. Alexandrov and L. Fursin: Electronics Letters Vol. 38 No. 22 pages 1389-1390.

5. H. Lendenmann, A. Mukhitdinov and F. Dahlquist: Power Semiconductor Devices and ISPSD'01 pages 31-34.

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Development of 17 kV 4H-SiC PiN diode;Journal of Semiconductors;2016-08

2. Development of 10 kV 4H-SiC JBS diode with FGR termination;Journal of Semiconductors;2014-07

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