Bond Mechanics and Failure Mode of Conductive Silver Adhesive for Transducer-Reference-Cited by-同舟云学术

Bond Mechanics and Failure Mode of Conductive Silver Adhesive for Transducer

Published:2013-12 Issue: Volume:873 Page:837-844
ISSN:1662-8985
Container-title:Advanced Materials Research
language:
Short-container-title:AMR

Author:

Wang Chun Ying¹,Zhang Rui¹

Affiliation:

1. Harbin Institute of Technology

Abstract

In this paper, a novel conductive silver adhesive (ECA) for transducer is prepared to bond piezoelectric patch and the aluminum substrate. X-ray photoelectron spectroscopy (XPS) is used to study the fracture elements in order to analyze bond mechanics, fracture morphology is observation by scanning electron microscopy (SEM). The result of test and analysis shows ECA with sliane coupling agent have both physical and chemical bonding and the fracture type is cohesive failure. However the ECA without sliane coupling agent only has physical bonding and fracture type is mixed failure.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Link

https://www.scientific.net/AMR.873.837.pdf

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