Affiliation:
1. Guilin University of Technology
Abstract
A new epoxy resin based on dichlorosilane and 9,9-bis (4-hydroxyphenyl) fluorene was synthesized to produce a highly heat-resistant network. The chemical structure was characterized with FTIR spectroscopy and 1H-NMR. 4-4′-Diaminodiphenylsulfone (DDS) was used as the curing agent. The curing kinetics of different epoxy/DDS systems were investigated using non-isothermal differential scanning calorimetry (DSC). The results showed that the values of activation energy (E) were affected by the chemical structure of epoxy resin, and BPEBF exhibited lower curing reactivity towards DDS compared to E-51.
Publisher
Trans Tech Publications, Ltd.
Reference17 articles.
1. Lee, K. Neville, Handbook of epoxy resins, NK. McGraw-Hill. (1967).
2. G. Lubin, Handbook of composites, NK. Nostrand Reinhold. (1982).
3. P. Chen, D.Z. Wang, Applications of epoxy resins, Beijing. Academic. (2001).
4. P. Khurana, S. Aggarwal, A.K. Narula, V. Choudhary, Studies on the curing and thermal behaviour of DGEBA in the presence of bis(4-carboxyphenyl) dimethyl silane. Polym. Int. 52(2003) 908-917.
5. E. Sharmin, L. Imo, S.M. Ashraif, S. Ahmad, Acrylic-melamine modified DGEBA-epoxy coatings and their anticorrosive behavior, Prog. Org. Coat. 50(2004) 47-54.
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献