Microstrain and Residual Stress in Thin-Films Made from Silver Nanoparticles Deposited by Inkjet-Printing Technology

Abstract

Colloidal suspensions of nanoparticles are increasingly employed in the fabrication process of electronic devices using inkjet-printing technology and a consecutive thermal treatment. The evolution of internal stresses during the conversion of silver nanoparticle-based ink into a metallic thin-film by a thermal sintering process has been investigated by in-situ XRD using the sin2ψ method. Despite the CTE mismatch at the film/substrate interface, the residual stress in silver films (below 70 MPa) remains lower than in conventional PVD thin-films, as a result of the remaining porosity. A Warren-Averbach analysis further showed that the crystallite growth is associated with a minimization of the twin fault density and the elastic microstrain energy above 150°C. A stabilization of the microstructure and internal stress is observed above 300°C. Inkjet-printing technology thus appears as a good alternative to conventional metallization techniques and offers significant opportunities asset for interconnect and electronic packaging.