Status and Prospect of Disassembly Process of Electronic Components on Waste PCBs-Reference-Cited by-同舟云学术

Status and Prospect of Disassembly Process of Electronic Components on Waste PCBs

Published:2014-08 Issue: Volume:599-601 Page:1989-1992
ISSN:1662-7482
Container-title:Applied Mechanics and Materials
language:
Short-container-title:AMM

Author:

Li Pei Lun¹,Shi Yi Feng¹,Liu Dian Wen¹

Affiliation:

1. Kunming University of Science and Technology

Abstract

With the development and exhaustion of resources, the reclamation of secondary resources, especially urban mine, must be on the agenda. The major part of urban mine is waste printed circuit board (WPCB), and the effective processing of WPCB is depend on the disassembly. This article analyze the form of fastening, the method of fusion welding ,the recovery of welding and the disassembly of electronic component in process of disassembly, and point out the direction and tendency of development.

Publisher

Trans Tech Publications, Ltd.

Link

https://www.scientific.net/AMM.599-601.1989.pdf

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